Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/15/2015
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Application #:
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13883936
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Filing Dt:
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05/07/2013
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Publication #:
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Pub Dt:
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12/19/2013
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Inventors:
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Xiaowei Guo, Wei Mu, Wenhai He, Xinjun Wang
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Title:
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CARRIER-FREE LAND GRID ARRAY IC CHIP PACKAGE AND PREPARATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.14, SHUANGQIAO ROAD, QINZHOU DISTRICT |
| TIANSHUI, GANSU, CHINA 741000 |
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| HAMRE, SCHUMANN, MUELLER & LARSON, P.C. |
| 45 SOUTH SEVENTH STREET |
| SUITE 2700 |
| MINNEAPOLIS, MN 55402 |
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