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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9142496
Issue Dt:
09/22/2015
Application #:
14444370
Filing Dt:
07/28/2014
Inventors:
Gregory E. Howard, Rajiv Dunne, Siva P. Gurrum, Donald C. Abbott, Bernardo Gallegos et al
Title:
Semiconductor Package Having Etched Foil Capacitor Integrated Into Leadframe
Assignment: 1
Reel/Frame:
035864/0617Recorded: 06/19/2015Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
HOWARD, GREGORY E
Exec Dt:
11/03/1997
Assignee:
TEXAS INSTRUMENTS INCORPORATED
P.O. BOX 655474 MS 3999
DALLAS, TEXAS 75265
Correspondent:
TEXAS INSTRUMENTS INCORPORATED
P.O. BOX 655474 MS 3999
DALAS, TX 75265
Assignment: 2
Reel/Frame:
034574/0693Recorded: 12/23/2014Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
GALLEGOS, BERNARDO
Exec Dt:
10/02/2014
GURRUM, SIVA P.
Exec Dt:
10/02/2014
PRAKUZHY, MANU J.
Exec Dt:
10/02/2014
ABBOTT, DONALD C.
Exec Dt:
09/30/2014
EDWARDS, DARVIN R
Exec Dt:
12/12/2014
DUNNE, RAJIV
Exec Dt:
10/21/2014
Assignee:
TEXAS INSTRUMENTS INCORPORATED
P.O. BOX 655474, MS 3999
DALLAS, TEXAS 75265
Correspondent:
TEXAS INSTRUMENTS INCORPORATED
P O BOX 655474, M/S 3999
DALLAS, TX 75265

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