Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/22/2015
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Application #:
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12784266
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Filing Dt:
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05/20/2010
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Publication #:
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Pub Dt:
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11/24/2011
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Inventors:
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Wen-Wei Shen, Ying-Ching Shih, Chen-Shien Chen, Ming-Fa Chen
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Title:
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Substrate Interconnections having Different Sizes
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| SLATER & MATSIL, L.L.P. |
| 17950 PRESTON RD., SUITE 1000 |
| DALLAS, TX 75252 |
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