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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/29/2015
Application #:
14548632
Filing Dt:
11/20/2014
Publication #:
Pub Dt:
03/12/2015
Inventors:
Yan Xun Xue, Hamza Yilmaz
Title:
MULTI-DIE POWER SEMICONDUCTOR DEVICE PACKAGED ON A LEAD FRAME UNIT WITH MULTIPLE CARRIER PINS AND A METAL CLIP
Assignment: 1
Reel/Frame:
034218/0447Recorded: 11/20/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/19/2014
Exec Dt:
11/19/2014
Assignee:
475 OAKMEAD PKWY,
SUNNYVALE, CALIFORNIA 94085
Correspondent:
CHEIN-HWA S. TSAO
6684 MT PAKRON DRIVE
SAN JOSE, CA 95120

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