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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9165970
Issue Dt:
10/20/2015
Application #:
13028471
Filing Dt:
02/16/2011
Publication #:
20120205769
Pub Dt:
08/16/2012
Inventors:
Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Hsiao-Hui Tseng
Title:
Back side illuminated image sensor having isolated bonding pads
Assignment: 1
Reel/Frame:
025817/0655Recorded: 02/16/2011Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TSAI, SHUANG-JI
Exec Dt:
02/09/2011
YAUNG, DUN-NIAN
Exec Dt:
02/09/2011
LIU, JEN-CHENG
Exec Dt:
02/09/2011
WANG, WEN-DE
Exec Dt:
02/09/2011
TSENG, HSIAO-HUI
Exec Dt:
02/09/2011
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6
HSIN-CHU, TAIWAN 300-77
Correspondent:
HAYNES AND BOONE, LLP
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219
Assignment: 2
Reel/Frame:
042002/0537Recorded: 04/13/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
WANG, WEN-DE
Exec Dt:
02/17/2017
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6
HSIN-CHU, TAIWAN 300-77
Correspondent:
HAYNES AND BOONE, LLP
2323 VICTORY AVENUE, STE. 700
DALLAS, TX 75219

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