Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/03/2015
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Application #:
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14491728
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Filing Dt:
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09/19/2014
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Inventors:
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Jungrae Park, Ajay Kumar, Brad Eaton, Wei-Sheng Lei, James S. Papanu
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Title:
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HYBRID WAFER DICING APPROACH USING LASER SCRIBING PROCESS BASED ON AN ELLIPTICAL LASER BEAM PROFILE OR A SPATIO-TEMPORAL CONTROLLED LASER BEAM PROFILE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| JUSTIN K. BRASK |
| 1279 OAKMEAD PARKWAY |
| SUNNYVALE, CA 94085-4040 |
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