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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
11/17/2015
Application #:
14366488
Filing Dt:
06/18/2014
Publication #:
Pub Dt:
12/11/2014
Inventors:
Gang Wei, Chun Wang, Dongsan Li
Title:
SUBSTRATE ETCHING METHOD AND SUBSTRATE PROCESSING DEVICE
Assignment: 1
Reel/Frame:
033139/0251Recorded: 06/19/2014Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/07/2014
Exec Dt:
06/07/2014
Exec Dt:
06/07/2014
Assignee:
NO. 8 WENCHANG AVENUE
BEIJING ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA
BEIJING, CHINA 100176
Correspondent:
EDWARDS WILDMAN PALMER LLP
525 OKEECHOBEE BLVD.
SUITE 1600
WEST PALM BEACH, FL 33401
Assignment: 2
Reel/Frame:
046419/0493Recorded: 06/25/2018Pages: 5
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/03/2017
Assignee:
NO. 1 EAST JIUXIANQIAO ROAD
CHAOYANG DISTRICT
BEIJING, CHINA 100016
Correspondent:
LOCKE LORD LLP
P.O. BOX 55874
BOSTON, MA 02215

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