Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/17/2015
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Application #:
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13281534
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Filing Dt:
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10/26/2011
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Publication #:
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Pub Dt:
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05/02/2013
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Inventors:
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Amit Subhash Kelkar, Karthik Thambidurai, Viren Khandekar, Hien D. Nguyen
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Title:
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THREE-DIMENSIONAL CHIP-TO-WAFER INTEGRATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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120 SAN GABRIEL DRIVE |
SUNNYVALE, CALIFORNIA 94086 |
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ADVENT IP/MAXIM |
2425 SOUTH 144TH STREET, SUITE 202 |
OMAHA, NE 68144 |
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