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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/01/2015
Application #:
14307652
Filing Dt:
06/18/2014
Publication #:
Pub Dt:
10/02/2014
Inventors:
KUO-FU SU, GWUN-JIN LIN
Title:
STRUCTURE OF VIA HOLE OF ELECTRICAL CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
033126/0844Recorded: 06/18/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/18/2014
Exec Dt:
06/18/2014
Assignee:
NO. 1, SONGJIANG S. RD.
ZHONGLI CITY, TAOYUAN COUNTY, TAIWAN 320
Correspondent:
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE, SUITE 101
ELLICOTT CITY, MD 21043

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