Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/08/2015
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Application #:
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14223895
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Filing Dt:
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03/24/2014
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Inventors:
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Dale G. Wilson, Douglas R. Hackler SR.
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Title:
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METHOD OF PRODUCING ENCAPSULATED IC DEVICES ON A WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6987 W. TARGEE STREET |
| BOISE, IDAHO 83709 |
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| ROBERT FROHWERK |
| 551 E. CLEARVUE DR |
| MERIDIAN, ID 83646-5213 |
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