Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/05/2016
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Application #:
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14447403
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Filing Dt:
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07/30/2014
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Inventors:
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Tsai-Fu HSIAO, Chun-Yao WANG, Tai-Chun HUANG, Tze-Liang LEE
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Title:
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WAFER PROCESSING CHAMBER, HEAT TREATMENT APPARATUS AND METHOD FOR PROCESSING WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD.6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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| R. BURNS ISRAELSEN |
| MASCHOFF BRENNAN |
| 1389 CENTER DRIVE, SUITE 300 |
| PARK CITY, UT 84098 |
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