Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/02/2016
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Application #:
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14018697
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Filing Dt:
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09/05/2013
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Publication #:
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Pub Dt:
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03/05/2015
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Inventors:
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Kun-Chih CHAN, Sheng-Chi LIN, Shin-Kung CHEN
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Title:
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WAFER-LEVEL TESTING METHOD FOR SINGULATED 3D-STACKED CHIP CUBES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26, DATONG RD., HSINCHU INDUSTRIAL PARK, HUKOU SHIANG |
| HSINCHU, TAIWAN |
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| MUNCY, GEISSLER, OLDS & LOWE, PLLC |
| 4000 LEGATO ROAD |
| SUITE 310 |
| FAIRFAX, VA 22033 |
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