Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/02/2016
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Application #:
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14484970
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Filing Dt:
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09/12/2014
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Publication #:
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Pub Dt:
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03/19/2015
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Inventors:
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Heng-Chieh CHIEN, Yu-Lin CHAO, Sheng-Tsai WU, John H. LAU, Wei-Chung LO
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Title:
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THINNED INTEGRATED CIRCUIT DEVICE AND MANUFACTURING PROCESS FOR THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 195, SEC. 4, CHUNG-HSING RD., CHU-TUNG |
HSINCHU, TAIWAN |
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MORRIS MANNING MARTIN LLP |
3343 PEACHTREE ROAD, NE |
1600 ATLANTA FINANCIAL CENTER |
ATLANTA, GA 30326 |
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