Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/02/2016
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Application #:
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13207633
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Filing Dt:
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08/11/2011
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Publication #:
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Pub Dt:
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08/30/2012
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Inventors:
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Yaojian Lin, Il Kwon Shim, Seng Guan Chow
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Title:
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Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE |
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EDWARD J. MAYLE |
1850 K STREET, N.W. |
SUITE 1100 |
WASHINGTON, DC 20006 |
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Assignment:
2
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THIS SUBMISSION IS TO CORRECT A TYPOGRAPHICAL ERROR IN THE COVER SHEET PREVIOUSLY RECORDED ON REEL: 038378 FRAME: 0382 TO CORRECT THE SPELLING OF ASSIGNEE'S NAME FROM "STATS CHIPPAC PTE. LTE." TO "STATS CHIPPAC PTE. LTD."
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE |
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KATTEN MUCHIN ROSENMAN LLP |
1919 PENNSYLVANIA AVE., NW - SUITE 800 |
WASHINGTON, DC 20006 |
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