Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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02/02/2016
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Application #:
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13235782
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Filing Dt:
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09/19/2011
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Publication #:
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Pub Dt:
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04/05/2012
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Inventor:
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Kazuyoshi ARAI
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Title:
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SEMICONDUCTOR DEVICE HAVING MULTILAYER WIRING STRUCTURE AND MANUFACTURING METHOD OF THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6-2, HONMACHI 1-CHOME, SHIBUYA-KU, |
TOKYO, JAPAN 151-8543 |
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HOLTZ, HOLTZ, GOODMAN & CHICK PC |
220 FIFTH AVENUE |
16TH FLOOR |
NEW YORK, NY 10001-7708 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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10-6, IMAI 3-CHOME, OME-SHI, |
TOKYO,, JAPAN 198-8555 |
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LEONARD HOLTZ |
220 FIFTH AVENUE |
16TH FLOOR |
NEW YORK, NY 10001 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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2-7-17, SHIN-YOKOHAMA, KOHOKU-KU, |
YOKOHAMA, KANAGAWA, JAPAN 222--0033 |
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LEONARD HOLTZ |
220 FIFTH AVENUE |
16TH FLOOR |
NEW YORK, NY 10001-7708 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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455-1, KOHZAI-MINAMIMACHI |
TAKAMATSU-SHI |
KAGAWA, JAPAN 761-8014 |
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HARNESS, DICKEY & PIERCE, P.L.C. |
P.O. BOX 828 |
BRYANT E. WADE |
BLOOMFIELD HILLS, MI 48303 |
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