Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/02/2016
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Application #:
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14330473
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Filing Dt:
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07/14/2014
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Publication #:
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Pub Dt:
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10/30/2014
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Inventors:
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Chun Che HUANG, Chiang-Ming CHUANG, Shih-Chieh CHANG
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Title:
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METHOD OF MAKING BOND PAD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| LOWE HAUPTMAN & HAM, LLP (TSMC) |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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