Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/09/2016
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Application #:
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12655407
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Filing Dt:
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12/30/2009
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Publication #:
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Pub Dt:
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06/30/2011
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Inventors:
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Deepak V. Kulkarni, Carl L. Deppisch, Leonel R. Arana, Gregory S. Constable et al
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Title:
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Methods of fabricating low melting point solder reinforced sealant and structures formed thereby
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95052 |
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INTEL CORPORATION |
C/O CPA GLOBAL |
P.O. BOX 52050 |
MINNEAPOLIS, MN 55402 |
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