Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/01/2016
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Application #:
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13582453
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Filing Dt:
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11/13/2012
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Publication #:
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Pub Dt:
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05/16/2013
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Inventors:
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Venkatesh Sundaram, Fuhan Liu, Rao R. Tummala, Vijay Sukumaran, Vivek Sridharan et al
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Title:
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THROUGH-PACKAGE-VIA (TPV) STRUCTURES ON INORGANIC INTERPOSER AND METHODS FOR FABRICATING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 505 TENTH STREET, NW |
| ATLANTA, GEORGIA 30332-0415 |
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| RYAN A. SCHNEIDER |
| 600 PEACHTREE STREET, NE, SUITE 5200 |
| BANK OF AMERICA PLAZA |
| ATLANTA, GA 30308-2216 |
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