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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/01/2016
Application #:
14591551
Filing Dt:
01/07/2015
Publication #:
Pub Dt:
05/07/2015
Inventors:
Hsin-Chang TSAI, Chia-Yen LEE, Peng-Hsin LEE
Title:
METHOD OF FORMING INTERCONNECTION STRUCTURE OF PACKAGE STRUCTURE
Assignment: 1
Reel/Frame:
061695/0106Recorded: 11/08/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/19/2022
Assignee:
6F, NO. 252, SHANYING RD., GUISHAN DIST.
TAOYUAN CITY, TAIWAN 333425
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, PC
4000 LEGATO RD., SUITE 310
FAIRFAX, VA 22033

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