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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/15/2016
Application #:
14337977
Filing Dt:
07/22/2014
Publication #:
Pub Dt:
01/21/2016
Inventors:
Daniel J. BUVID, Tyler JANDT, Eric J. CAMPBELL, Joseph KUCZYNSKI
Title:
DEVICES EMPLOYING SEMICONDUCTOR DIE HAVING HYDROPHOBIC COATINGS, AND RELATED COOLING METHODS
Assignment: 1
Reel/Frame:
033366/0315Recorded: 07/22/2014Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/08/2014
Exec Dt:
07/08/2014
Exec Dt:
07/08/2014
Exec Dt:
07/10/2014
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
PATTERSON & SHERIDAN, LLP/IBM ROC
24 GREENWAY PLAZA
SUITE 1600
HOUSTON, TX 77046

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