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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/15/2016
Application #:
13053528
Filing Dt:
03/22/2011
Publication #:
Pub Dt:
04/12/2012
Inventor:
MING-CHE WU
Title:
CHIP LEVEL EMI SHIELDING STRUCTURE AND MANUFACTURE METHOD THEREOF
Assignment: 1
Reel/Frame:
026011/0281Recorded: 03/22/2011Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/22/2011
Assignees:
NO. 1558, ZHANG DONG ROAD
ZHANGJIANG HI-TECH PARK
SHANGHAI, P. R., CHINA 201203
NO. 141, LN. 351, SEC. 1, TAIPING RD.
CAOTUN TOWNSHIP
NANTOU COUNTY 54261, TAIWAN R.O.C.
Correspondent:
MORTON J. ROSENBERG, ESQ.
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE
SUITE 101
ELLICOTT CITY, MD 21043

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