Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/29/2016
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Application #:
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14047978
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Filing Dt:
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10/07/2013
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Publication #:
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Pub Dt:
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10/30/2014
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Inventors:
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Hiren D. Thacker, Robert David Hopkins II, Xuezhe Zheng, Ivan Shubin et al
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Title:
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HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 500 ORACLE PARKWAY |
| MAIL STOP 5OP7 |
| REDWOOD CITY, CALIFORNIA 94065 |
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| A. RICHARD PARK |
| PARK, VAUGHAN, FLEMING & DOWLER LLP |
| 2820 FIFTH STREET |
| DAVIS, CA 95618 |
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