Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/29/2016
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Application #:
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14285601
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Filing Dt:
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05/22/2014
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Inventors:
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Byung Tai Do, Arnel Trasporto, Zigmund Ramirez Camacho
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTED CIRCUIT LEAD ARRAY AND METHOD OF MANUFACTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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10 ANG MO KIO STREET 65 |
#05-17/20 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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WONG & REES LLP |
4677 OLD IRONSIDES DRIVE |
SUITE 370 |
SANTA CLARA, CA 95054 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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10 ANG MO KIO STREET 65 |
#04-08/09 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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WONG & REES LLP |
4677 OLD IRONSIDES DRIVE |
SUITE 370 |
SANTA CLARA, CA 95054 |
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06/14/2024 09:54 AM
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