Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/05/2016
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Application #:
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14150307
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Filing Dt:
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01/08/2014
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Publication #:
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Pub Dt:
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07/10/2014
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Inventors:
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Zhi-Qi WANG, Qiong YU, Wei WANG
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Title:
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WAFER-LEVEL PACKAGING METHOD OF BSI IMAGE SENSORS HAVING DIFFERENT CUTTING PROCESSES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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29 TINGLAN LANE |
SUZHOU INDUSTRIAL PARK |
SUZHOU, CHINA 215126 |
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TIMOTHY L. BOLLER |
701 FIFTH AVENUE |
SUITE 5400 |
SEATTLE, WA 98104 |
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