Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2016
|
Application #:
|
14363996
|
Filing Dt:
|
11/10/2014
|
|
Publication #:
|
|
Pub Dt:
|
03/05/2015
| | | | |
|
Inventors:
|
Xizhou Li, Wei Mu, Xiaowei Guo
|
|
Title:
|
DENSE-PITCH SMALL-PAD COPPER WIRE BONDED DOUBLE IC CHIP STACK PACKAGING PIECE AND PREPARATION METHOD THEREFOR
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO.14, SHUANGQIAO ROAD, QINZHOU DISTRICT |
| TIANSHUI, GANSU, CHINA 741000 |
|
|
|
| NO.105, THE 5TH ROAD OF FENGCHENG ECONOMIC DEVELOPMENT ZONE |
| XI'AN, SHAANXI, CHINA 710000 |
|
|
|
|
| HAMRE, SCHUMANN, MUELLER & LARSON, P.C. |
| P.O. BOX 2902 |
| MINNEAPOLIS, MN 55402-0902 |
|
|
Search Results as of:
06/07/2024 05:50 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
