Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/19/2016
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Application #:
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14514360
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Filing Dt:
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10/14/2014
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Publication #:
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Pub Dt:
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05/14/2015
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Inventors:
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Charles W. C. Lin, Chia-Chung Wang
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Title:
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SEMICONDUCTOR PACKAGE WITH PACKAGE-ON-PACKAGE STACKING CAPABILITY AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3FL., 157 LI-TE ROAD, PEITOU DIST. |
| TAIPEI, TAIWAN 11259 |
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| CHAO-CHANG DAVID PAI |
| 1001 FOURTH AVENUE, SUITE 3200 |
| SEATTLE, WA 98154 |
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