Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/10/2016
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Application #:
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13712326
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Filing Dt:
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12/12/2012
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Publication #:
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Pub Dt:
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02/13/2014
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Inventors:
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Hae Won Jeong, Hyun Dal Park, Seung Kyu Kim, Ho June Yoon, Joo Dong Lee, Sun Myung Lee et al
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Title:
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LEAD-FREE SOLDER COMPOSITION FOR GLASS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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231 YANGJAE-DONG, SEOCHO-GU |
SEOUL, KOREA, REPUBLIC OF 137-938 |
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231 YANGJAE-DONG, SEOCHO-GU |
SEOUL, KOREA, REPUBLIC OF 137-938 |
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1 BEULLOK, JEONUIJIBANG REGIONAL INDUSTRIAL TOWN, SINJEONG-RI, JEONUI-MYEON |
YEONGI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 339-853 |
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113-19, DANGHA-RO, NAMSA-MYEON, CHEOIN-GU |
YONGIN, GYEONGGI-DO, KOREA, REPUBLIC OF 449-880 |
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EDWARDS WILDMAN PALMER LLP |
P.O. BOX 55874 |
BOSTON, MA 02205 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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587, GANGNAM-DAERO, SEOCHO-GU |
SEOUL, KOREA, REPUBLIC OF |
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JANICE H. LOGAN |
1111 PENNSYLVANIA AVE NW |
WASHINGTON, DC 20004 |
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