Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/24/2016
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Application #:
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14261281
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Filing Dt:
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04/24/2014
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Publication #:
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Pub Dt:
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10/30/2014
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Inventors:
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David Campion, Jason Boyd, Jacob Stafford, Travis Deleve
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Title:
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SEMICONDUCTOR WAFER CHUCK AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 219 E. 50TH ST. |
| BOISE, IDAHO 83714 |
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| PARSONS BEHLE & LATIMER |
| 800 W. MAIN STREET |
| SUITE 1300 |
| BOISE, ID 83702 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 219 E. 50TH ST. |
| BOISE, IDAHO 83714 |
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| PARSONS BEHLE & LATIMER |
| 800 W. MAIN STREET, SUITE 1300 |
| ATTN: DOCKETING |
| BOISE, ID 83702 |
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