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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/24/2016
Application #:
13692414
Filing Dt:
12/03/2012
Publication #:
Pub Dt:
06/05/2014
Inventors:
Chuan-Ling Wu, Cheng-Hsien Chuang, Chun-Chang Chen, Wang-Pen Mo, Hung-Chang Hsieh
Title:
Test Structure Placement on a Semiconductor Wafer
Assignment: 1
Reel/Frame:
029833/0871Recorded: 02/19/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/15/2012
Exec Dt:
11/15/2012
Exec Dt:
11/15/2012
Exec Dt:
11/15/2012
Exec Dt:
11/21/2012
Assignee:
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
HAYNES AND BOONE, LLP
2323 VICTORY AVENUE, STE. 700
DALLAS, TX 75219

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