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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/24/2016
Application #:
14664850
Filing Dt:
03/21/2015
Publication #:
Pub Dt:
07/09/2015
Inventors:
Steven Huynh, Tsing Hsu
Title:
POWER MANAGEMENT MULTI-CHIP MODULE WITH SEPARATE HIGH-SIDE DRIVER INTEGRATED CIRCUIT DIE
Assignment: 1
Reel/Frame:
035224/0312Recorded: 03/21/2015Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/05/2012
Exec Dt:
11/05/2012
Assignee:
P.O. BOX 957
OFFSHORE INCORPORATIONS CENTRE, ROAD TOWN
TORTOLA, VIRGIN ISLANDS, BRITISH
Correspondent:
IMPERIUM PATENT WORKS
P.O. BOX 607
PLEASANTON, CA 94566

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