Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/31/2016
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Application #:
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14088513
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Filing Dt:
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11/25/2013
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Publication #:
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Pub Dt:
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05/28/2015
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Inventors:
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HSIU-JEN LIN, WEN-HSIUNG LU, CHENG-TING CHEN, HSUAN-TING KUO, WEI-YU CHEN, MING-DA CHENG et al
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Title:
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SEMICONDUCTOR PACKAGING AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
HSINCHU, TAIWAN |
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IPR SERVICES |
P.O. BOX 220746 |
CHANTILLY, VA 20153 |
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05/24/2024 03:51 AM
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