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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
9368489
Issue Dt:
06/14/2016
Application #:
13781497
Filing Dt:
02/28/2013
Publication #:
20160148901
Pub Dt:
05/26/2016
Inventors:
Rodrigo Alvarez-Icaza Rivera, John E. Barth, Dharmendra S. Modha, Subramanian S. Iyer et al
Title:
INTERCONNECT CIRCUITS AT THREE-DIMENSIONAL (3-D) BONDING INTERFACES OF A PROCESSOR ARRAY
Assignment: 1
Reel/Frame:
029902/0291Recorded: 02/28/2013Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ALVAREZ-ICAZA RIVERA, RODRIGO
Exec Dt:
02/13/2013
ARTHUR, JOHN V.
Exec Dt:
02/12/2013
BARTH, JOHN E., JR.
Exec Dt:
02/13/2013
CASSIDY, ANDREW S.
Exec Dt:
02/13/2013
IYER, SUBRAMANIAN S.
Exec Dt:
02/21/2013
JACKSON, BRYAN L.
Exec Dt:
02/12/2013
MEROLLA, PAUL A.
Exec Dt:
02/12/2013
MODHA, DHARMENDRA S.
Exec Dt:
02/12/2013
SAWADA, JUN
Exec Dt:
02/14/2013
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
SHERMAN & ZARRABIAN LLP (IBM2/IBM2-S)
1411 5TH STREET, SUITE 306
SANTA MONICA, CA 90401

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