Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/26/2016
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Application #:
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14656631
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Filing Dt:
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03/12/2015
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Publication #:
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Pub Dt:
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10/15/2015
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Inventor:
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Chi-Jin SHIH
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Title:
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QUAD FLAT NO-LEAD PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, R&D RD. 1 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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| PATTERSON + SHERIDAN, LLP |
| 595 SHREWSBURY AVENUE |
| SUITE 100 |
| SHREWSBURY, NJ 07702 |
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