Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/02/2016
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Application #:
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13305384
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Filing Dt:
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11/28/2011
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Publication #:
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Pub Dt:
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06/07/2012
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Inventors:
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David W. PORTER, Steven T. MAYER
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Title:
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ELECTROPLATING APPARATUS AND PROCESS FOR WAFER LEVEL PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4000 NORTH FIRST STREET |
| SAN JOSE, CALIFORNIA 95134 |
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| WEAVER AUSTIN VILLENEUVE & SAMPSON LLP |
| P.O. BOX 70250 |
| ATTN.: ANNA GAVRILOVA/TVL |
| OAKLAND, CA 94612-0250 |
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