Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/09/2016
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Application #:
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14325081
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Filing Dt:
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07/07/2014
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Publication #:
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Pub Dt:
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08/27/2015
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Inventors:
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Tae Ho LEE, Il Hwan CHO, In Chul HWANG, Ga Hyun NO
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Title:
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PACKAGE SUBSTRATES, PACKAGES INCLUDING THE SAME, METHODS OF FABRICATING THE PACKAGES WITH THE PACKAGE SUBSTRATES, ELECTRONIC SYSTEMS INCLUDING THE PACKAGES, AND MEMORY CARDS INCLUDING THE PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
| ICHEON, KOREA, REPUBLIC OF 467-734 |
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| AMPACC LAW GROUP, PLLC |
| 6100 219TH ST. SW |
| SUITE 580 |
| MOUNTLAKE TERRACE, WA 98043 |
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