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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/09/2016
Application #:
13829921
Filing Dt:
03/14/2013
Publication #:
Pub Dt:
09/18/2014
Inventors:
Ryan B. Wicker, Francisco Medina, Eric MacDonald, Danny W. Muse, David Espalin
Title:
Method For Connecting Inter-Layer Conductors and Components in 3D Structures
Assignment: 1
Reel/Frame:
030394/0792Recorded: 05/10/2013Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/08/2013
Exec Dt:
05/08/2013
Exec Dt:
05/08/2013
Exec Dt:
05/08/2013
Exec Dt:
05/08/2013
Assignee:
201 WEST 7TH STREET
AUSTIN, TEXAS 78701
Correspondent:
CYNTHIA MINCHILLO
C/O CHALKER FLORES, LLP
14951 N. DALLAS PARKWAY, SUITE 400
DALLAS, TX 75254

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