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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/16/2016
Application #:
14731666
Filing Dt:
06/05/2015
Publication #:
Pub Dt:
12/10/2015
Inventors:
Christoph Schelling, Ralf Reichenbach, Jens Frey, Antoine Puygranier
Title:
Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements
Assignment: 1
Reel/Frame:
037546/0131Recorded: 01/21/2016Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/26/2015
Exec Dt:
06/17/2015
Exec Dt:
06/18/2015
Exec Dt:
06/17/2015
Assignee:
POSTFACH 30 02 20
STUTTGART, GERMANY DE-70442
Correspondent:
GERARD A. MESSINA
KENYON & KENYON LLP
ONE BROADWAY
NEW YORK, NY 10004-1007

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