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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9418877
Issue Dt:
08/16/2016
Application #:
14324136
Filing Dt:
07/04/2014
Publication #:
20150318262
Pub Dt:
11/05/2015
Inventors:
Shiqun Gu, Ratibor Radojcic, Dong Wook Kim, Jae Sik Lee
Title:
INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS IN INORGANIC LAYERS AND REDISTRIBUTION LAYERS IN ORGANIC LAYERS
Assignment: 1
Reel/Frame:
033515/0559Recorded: 08/12/2014Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
GU, SHIQUN
Exec Dt:
08/06/2014
RADOJOIC, RATIBOR
Exec Dt:
08/05/2014
KIM, DONG WOOK
Exec Dt:
08/07/2014
LEE, JAE SIK
Exec Dt:
07/30/2014
Assignee:
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121-1714
Correspondent:
LOZA & LOZA, LLP/QUALCOMM
305 N. SECOND AVE., #127
UPLAND, CA 91786
Assignment: 2
Reel/Frame:
039266/0232Recorded: 07/06/2016Pages: 8
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE SECOND INVENTOR'S NAME PREVIOUSLY RECORDED ON REEL 033515 FRAME 0559. ASSIGNOR(S) HEREBY CONFIRMS THE
Assignors:
GU, SHIQUN
Exec Dt:
08/06/2014
RADOJCIC, RATIBOR
Exec Dt:
08/05/2014
KIM, DONG WOOK
Exec Dt:
08/07/2014
LEE, JAE SIK
Exec Dt:
07/30/2014
Assignee:
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121-1714
Correspondent:
LOZA & LOZA, LLP/ QUALCOMM
305 N. SECOND AVE., #127
UPLAND, CA 91786

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