Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/30/2016
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Application #:
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14535310
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Filing Dt:
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11/06/2014
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Publication #:
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Pub Dt:
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05/12/2016
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Inventors:
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Wai Hung, Xiaoming Yu, Wei Ma, Francis Guillen Gamboa, Dennis Tak Kit Tong
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Title:
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WAFER LEVEL PACKAGED OPTICAL SUBASSEMBLY AND TRANSCEIVER MODULE HAVING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T. |
| HONG KONG, HONG KONG |
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| B.Y.I.P., LTD |
| P.O. BOX 1484 OF GENERAL POST OFFICE |
| HONG KONG, HONG KONG |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3/F, SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T. |
| HONG KONG, HONG KONG |
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| B.Y.I.P., LTD |
| P.O. BOX 1484 OF GENERAL POST OFFICE |
| HONG KONG, HONG KONG |
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