Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/06/2016
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Application #:
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14179854
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Filing Dt:
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02/13/2014
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Publication #:
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Pub Dt:
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08/13/2015
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Inventors:
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Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee
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Title:
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Concentric Bump Design for the Alignment in Die Stacking
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINC-CHU, TAIWAN 300-77 |
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| SLATER & MATSIL, LLP |
| 17950 PRESTON RD. |
| SUITE 1000 |
| DALLAS, TX 75252 |
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