Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/20/2016
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Application #:
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14355521
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Filing Dt:
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04/30/2014
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Publication #:
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Pub Dt:
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09/25/2014
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Inventors:
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Hee Cheul Jung, Jung Hye Chae, Bo Ram I Jang, Jun Yong Park, Dae Woong Suh
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Title:
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LIGHT-EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1B-36, 727-5 WONSI-DONG, DANWON-GU |
| GYEONGGI-DO |
| ANSAN-SI, KOREA, REPUBLIC OF 425-851 |
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| H.C. PARK & ASSOCIATES, PLC |
| 1894 PRESTON WHITE DRIVE |
| RESTON, VA 20191 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 65-15, SANDAN-RO 163 BEON-GIL, DANWON-GU |
| GYEONGGI-DO |
| ANSAN-SI, KOREA, REPUBLIC OF |
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| H.C. PARK & ASSOCIATES, PLC |
| 1894 PRESTON WHITE DRIVE |
| RESTON, VA 20191 |
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