Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/20/2016
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Application #:
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13631959
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Filing Dt:
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09/29/2012
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Publication #:
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Pub Dt:
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04/03/2014
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Inventors:
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Dilan SENEVIRATNE, Ching-Ping J. SHEN, Liwen JIN, Deepak ARORA, Vinodhkumar RAGHUNATHAN
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Title:
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EMBEDDED ARCHITECTURE USING RESIN COATED COPPER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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KONRAD RAYNES DAVDA & VICTOR LLP |
350 S. BEVERLY DR. |
SUITE 360 |
BEVERLY HILLS, CA 90212 |
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