Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/04/2016
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Application #:
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14796506
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Filing Dt:
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07/10/2015
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Publication #:
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Pub Dt:
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01/14/2016
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Inventors:
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Jin-ho CHUN, Pil-kyu Kang, Byung-Iyul Park, Jae-hwa Park, Ju-il Choi
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Title:
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WAFER-TO-WAFER BONDING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO |
| YEONGTONG-GU, SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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| MYERS BIGEL SIBLEY & SAJOVEC |
| PO BOX 37428 |
| RALEIGH, NC 27627 |
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