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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9466586
Issue Dt:
10/11/2016
Application #:
14794185
Filing Dt:
07/08/2015
Inventors:
Jai Kyoung Choi, Eun Dong Kim, Su Kyung Lim, Hyun Hak Jung, Hyeong Min Kim
Title:
METHOD FOR MANUFACTURING WAFER-LEVEL FAN-OUT PACKAGE
Assignment: 1
Reel/Frame:
036025/0829Recorded: 07/08/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHOI, JAI KYOUNG
Exec Dt:
06/22/2015
KIM, EUN DONG
Exec Dt:
06/22/2015
JUNG, HYUN HAK
Exec Dt:
06/22/2015
KIM, HYEONG MIN
Exec Dt:
06/22/2015
LIM, SU KYUNG
Exec Dt:
06/22/2015
Assignee:
STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.
16, BAEKSEOKGONGDAN 7-RO, SEOBUK-GU, CHEONAN-SI
CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 330-220
Correspondent:
NOVAKD DRUCE CONNOLLY BOVE + QUIGG LLP
1875 I STREET, N.W.
ELEVENTH FLOOR
WASHINGTON, DC 20006
Assignment: 2
Reel/Frame:
036138/0757Recorded: 07/20/2015Pages: 5
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE CORRESPONDENCE INFORMATION PREVIOUSLY RECORDED AT REEL: 036025 FRAME: 0829. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
CHOI, JAI KYOUNG
Exec Dt:
06/22/2015
KIM, EUN DONG
Exec Dt:
06/22/2015
JUNG, HYUN HAK
Exec Dt:
06/22/2015
KIM, HYEONG MIN
Exec Dt:
06/22/2015
LIM, SU KYUNG
Exec Dt:
06/22/2015
Assignee:
STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.
16, BAEKSEOKGONGDAN 7-RO, SEOBUK-GU
CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 330-220
Correspondent:
NOVAK DRUCE CONNOLLY BOVE + QUIGG LLP
1875 I STREET, N.W.
ELEVENTH FLOOR
WASHINGTON, DC 20006

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