Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/18/2016
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Application #:
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13593479
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Filing Dt:
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08/23/2012
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Publication #:
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Pub Dt:
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02/27/2014
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Inventors:
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Tien-Chih Cheng, Ying Zhang, Shu-Huei Suen, Chen-Chiao Kao
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Title:
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WAFER SUPPORT DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. VI |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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MCDERMOTT WILL & EMERY LLP |
THE MCDERMOTT BUILDING |
500 NORTH CAPITOL STREET N.W. |
WASHINGTON, DC 20001 |
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