Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/01/2016
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Application #:
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13779249
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Filing Dt:
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02/27/2013
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Publication #:
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Pub Dt:
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08/28/2014
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Inventors:
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Chi-Sheng Chung, Kuo-Hsien Liao, Jin-Feng Yang, Chen-Yin Tai, Yung-I Yeh
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Title:
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SEMICONDUCTOR PACKAGES WITH THERMAL-ENHANCED CONFORMAL SHIELDING AND RELATED METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 26, CHIN 3RD ROAD |
NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN |
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KLEIN, O'NEILL & SINGH, LLP |
18200 VON KARMAN AVENUE |
SUITE 725 |
IRVINE, CA 92612 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE SECOND INVENTOR'S NAME FROM "YUNG-YI YEH" TO "YUNG-I YEH" PREVIOUSLY RECORDED ON REEL 032187 FRAME 0100. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT NAME OF THE SECOND INVENTOR IS "YUNG-I YEH".
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NO. 26, CHIN 3RD ROAD |
NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN |
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KLEIN, O'NEILL & SINGH, LLP |
18200 VON KARMAN AVENUE |
SUITE 725 |
IRVINE, CA 92612 |
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