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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9508549
Issue Dt:
11/29/2016
Application #:
14972522
Filing Dt:
12/17/2015
Publication #:
20160189953
Pub Dt:
06/30/2016
Inventors:
Jong Keun Park, Phillip D. Hustad, Emad Aqad, Mingqi Li, Cheng-Bai Xu, Peter Trefonas III et al
Title:
METHODS OF FORMING ELECTRONIC DEVICES INCLUDING FILLING POROUS FEATURES WITH A POLYMER
Assignment: 1
Reel/Frame:
040183/0987Recorded: 11/01/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PARK, JONG KEUN
Exec Dt:
10/01/2015
AQAD, EMAD
Exec Dt:
10/05/2015
LI, MINGQI
Exec Dt:
10/02/2015
XU, CHENG-BAI
Exec Dt:
10/05/2015
TREFONAS, PETER, III
Exec Dt:
10/01/2015
THACKERAY, JAMES W
Exec Dt:
10/01/2015
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS LLC
455 FOREST STREET
MARLBOROUGH, MASSACHUSETTS 01752
Correspondent:
KRISTIE ELLISON
2040 DOW CENTER
MIDLAND, MI 48674
Assignment: 2
Reel/Frame:
040183/0861Recorded: 11/01/2016Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
HUSTAD, PHILLIP D
Exec Dt:
10/05/2015
Assignee:
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER
MIDLAND, MICHIGAN 48674
Correspondent:
KRISTIE ELLISON
2040 DOW CENTER
MIDLAND, MI 48674

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