Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/29/2016
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Application #:
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13950178
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Filing Dt:
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07/24/2013
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Publication #:
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Pub Dt:
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01/29/2015
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Inventors:
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Brian H. Kim, Mozafar Maghsoudnia, Haijun She
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Title:
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ASSEMBLY AND PACKAGING OF MEMS DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1197 BORREGAS AVENUE |
SUNNYVALE, CALIFORNIA 94089 |
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IPXLAW GROUP LLP AND JAYANTHI G. SIMHA |
2901 MOORPARK AVENUE, SUITE 255 |
SAN JOSE, CA 95128 |
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