Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/06/2016
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Application #:
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14485674
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Filing Dt:
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09/13/2014
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Publication #:
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Pub Dt:
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12/25/2014
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Inventors:
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Tien-Jen Cheng, Mukta G. Farooq, John A. Fitzsimmons
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Title:
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METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| ZEHRER PATENT SERVICES |
| PO BOX 1186 |
| 345 W SAINT PAUL AVE |
| MILWAUKEE, WI 53201-1186 |
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