Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
12/13/2016
|
Application #:
|
14700420
|
Filing Dt:
|
04/30/2015
|
|
Publication #:
|
|
Pub Dt:
|
11/03/2016
| | | | |
|
Inventors:
|
Toyohiro Aoki, Hiroyuki Mori, Yasumitsu K. Orii, Kazushige Toriyama, Shintaro Yamamichi
|
|
Title:
|
Method of Forming a Solder Bump on a Substrate
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
|
|
|
|
| MICHAEL J. CHANG |
| 84 SUMMIT AVENUE |
| MICHAEL J. CHANG, LLC |
| MILFORD, CT 06460 |
|
|
Search Results as of:
05/02/2024 12:40 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
